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| 论文题目: | Enhancing interfacial heat conduction in diamond-reinforced copper composites with boron carbide interlayers for thermal management |
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| 作者: | 崔帅、孙方远、王大正、张兴、张海龙、冯艳辉 |
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| 刊物名称: | Composites Part B: Engineering |
| 年: | 2024 |
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Enhancing interfacial heat conduction in diamond-reinforced copper composites with boron carbide interlayers for thermal management